JUNG, Jae Pil
Professor
Science and Technology Building # 521
+82-2-6490-2408
jpjung@uos.ac.kr
Professor Jae Pil Jung is a Professor of Materials Science and Engineering with the Department of Materials Science and Engineering at the University of Seoul, and the current President of Korean Association of Micro-Electronics Packaging. He received his PhD in Metallurgical Engineering from the Seoul National University in 1992, an MSc in Materials Science from the Korea Advanced Institute of Science and Technology in 1985 and a BSc in Metallurgical Engineering from the Seoul National University in 1983. He worked as a senior researcher at the Korea Institute of Machinery and Materials before moving to the University of Seoul. He has served two terms as Professor and Chair of the Department of Materials Science and Engineering (2001-2003 and 2012 - 2014). He has also served as a Visiting Researcher with Joining & Welding Institute, Osaka University, Japan (1994-1995); Visiting Professor with the Centre for Advanced Materials Joining, University of Waterloo, Canada since (2003-2004); a Visiting Professor with the University of Greenwich (2008-2011) and a Visiting Professor with the University of Wolverhampton since 2014.
Professor Jung’s research interests are in interconnection materials and electronics packaging processes for semiconductor, electronics, car and etc. including soldering & brazing, electro-plating, and other micro-joining processes; and he has worked on microjoining since 1994, specializing on the development of microjoining materials and technologies; and miniaturization of electronic packages. Over the last decade, his research interests have shifted slightly to the use of nanocomposites for improving the properties of lead free solder alloys; and also on the study of failure mechanisms of nanostructured interconnects. He received Academic award, Best paper awards from several journals, best research award and teaching award from the University of Seoul, and awarded as the 100 leaders for 2020’s in Korea.
He leads the renowned Microjoining & Electronics Packaging Laboratory (http://campus.uos.ac.kr/micro/ ) at the University of Seoul. He has researched and published very widely on microjoining technologies with over 240 journal papers and 10 books; and he holds over 60 patents for his research. He has very strong partnerships with industry, and he has successfully transferred many patented technologies to multinational companies. His research partners cover many global companies of electronics, electronic materials, car, energy harvesting, steel companies and etc.
Professor Jung’s research interests are in interconnection materials and electronics packaging processes for semiconductor, electronics, car and etc. including soldering & brazing, electro-plating, and other micro-joining processes; and he has worked on microjoining since 1994, specializing on the development of microjoining materials and technologies; and miniaturization of electronic packages. Over the last decade, his research interests have shifted slightly to the use of nanocomposites for improving the properties of lead free solder alloys; and also on the study of failure mechanisms of nanostructured interconnects. He received Academic award, Best paper awards from several journals, best research award and teaching award from the University of Seoul, and awarded as the 100 leaders for 2020’s in Korea.
He leads the renowned Microjoining & Electronics Packaging Laboratory (http://campus.uos.ac.kr/micro/ ) at the University of Seoul. He has researched and published very widely on microjoining technologies with over 240 journal papers and 10 books; and he holds over 60 patents for his research. He has very strong partnerships with industry, and he has successfully transferred many patented technologies to multinational companies. His research partners cover many global companies of electronics, electronic materials, car, energy harvesting, steel companies and etc.
Education
Professor Jae Pil Jung leads the renowned Microjoining & Electronics Packaging Lab at University of Seoul, which enjoys an international reputation for work in microjoining technologies. He is President of Korea Association of Microelectronics Packaging and a summary of his credentials are as follows:
03/1985-03/1996 : Senior Researcher Korea Institute of Machinery & Materials
03/1996-Present : Professor, University of Seoul
1994-95 : Visiting Professor, Osaka University, Japan
2003-04 : Visiting Professor, University of Waterloo, Canada
2010-12 : Visiting Professor, University of Greenwich, UK
2017-Present : President, Korea Microelectronics Packaging Association
Professor Jae Pil Jung leads the renowned Microjoining & Electronics Packaging Lab at University of Seoul, which enjoys an international reputation for work in microjoining technologies. He is President of Korea Association of Microelectronics Packaging and a summary of his credentials are as follows:
03/1985-03/1996 : Senior Researcher Korea Institute of Machinery & Materials
03/1996-Present : Professor, University of Seoul
1994-95 : Visiting Professor, Osaka University, Japan
2003-04 : Visiting Professor, University of Waterloo, Canada
2010-12 : Visiting Professor, University of Greenwich, UK
2017-Present : President, Korea Microelectronics Packaging Association
PUBLICATIONS
Professor Jung has over 240 refereed journal papers and 350 conference presentations, based on his research work which is mostly concerned with electronics interconnections and joining. Some examples of his journal publications are given below:
2016– date, Journal Publications
1.Effect of ZrO2 nanoparticles on the microstructure of Al-Si-Cu filler for low-temperature Al brazing applications, Metallurgical and Materials Transactions A, Volume47, Number1, p.510-521, 2016
2.Effect of graphene nanoplatelets on wetting, microstructure, and tensile characteristics of Sn-3.0Ag-0.5Cu(SAC) alloy, Metallurgical and Materials Transactions A, Volume47, Number1, p.494-503, 2016
3.Compressive strength evaluation in brazed ZrO2/Ti-6Al-4V joints using finite element analysis, Ashutosh Sharma, Se Ho Kee, Flora Jung, Yongku Heo, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 5, p. 1722-1728, 2016
4.Microstructure and brazeability of SiC nanoparticles reinforced Al-9Si-20Cu produced by induction melting, Ashutosh Sharma, Dong-Uk Lim, Jae-Pil Jung, Materials Science and Technology, Volume 32, Number 8, p. 773-779, 2016
5.Effect of La2O3 nanoparticles on the brazeability, microstructure, and mechanical properties of Al-11Si-20Cu alloy, Ashutosh Sharma, Myung Hwan Roh, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 8, p. 3538-3545, 2016
6.Fabrication and shear strength analysis of Sn3.5Ag/Cu-filled TSV for 3D microelectronic packaging, Ashutosh Sharma, Do Hyun Jung, Myong Hoon Roh, Jae Pil Jung, Electronic Materials Letters, Volume 12, Number 6, p. 856-863, 2016
7.Thermal shock, shear and insulating characteristics of epoxy embedded SAC 305 solder joints, Ashutosh Sharma, Young Joo Jang, Jang Baek Kim, Jae Pil Jung, Journal of Alloys and Compounds, Volume 704, p. 795-803, 2017
8.Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders, Ashutosh Sharma, Santosh Kumar, Do Hyun Jung, Jae Pil Jung”, Journal of Materials Science: Materials in Electronics, 2017
9.Effect of AlN Nanoparticle Additions on Microstructure, Solderability and Mechanical Properties of Sn-Ag-Cu solder, Dohyun Jung, Ashutosh Sharma, Dong-Uk Lim, Heung Rak Sohn, Jae Pil Jung, Metallurgical and Materials Transactions A, (2017)
10.Effect of KOH to Na2SiO3 ratio on microstructure and mechanical properties of plasma electrolytic alumina coatings, Ashutosh Sharma, Yong Joo Jang, Jae Pil Jung, Journal of Materials Engineering and Performance, (2017).
11.Effect of brazing current and speed on the microstructure, weld characteristics and mechanical properties of the arc brazed hot-dip galvanized steel sheets using Cu3Si filler, Ashutosh Sharma, Soon Jae Lee, Do Youl Choi, Jae Pil Jung, Journal of Materials Processing and Technology, (2017).
12.Radiation induced errors and low alpha solder bumping solder process in 3-D packaging technology, Do Hyun Jung, Ashutosh Sharma, Jae Pil Jung, Journal of Materials Science (2017).
13.Recent progress in electroless plating of copper, Ashutosh Sharma, Chu-Seon Cheon, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Volume 23, Number 4, p. 1-6, 2016
14.Recent Advances in Thermoelectric Power Generation Technology, Ashutosh Sharma, Jun Hyeong Lee, Kyung Heum Kim, Jae Pil Jung, Journal of the Microelectronics Packaging and Society, 24(1), 1-8 (2017)
15.Effect of various factors on the brazed joint properties in Al brazing technology, Ashutosh Sharma, Seung Hyun Lee, Hyung Oh Ban Y.S. Shin, Jae-Pil Jung, Journal of Welding and Joining, Volume 34, Number 2, p. 30-35, 2016
16.Transient liquid phase bonding for power semiconductor, Journal of the Microelectronics Packaging and Society, 24(2), (2017)
17.Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation, Journal of the Microelectronics Packaging and Society, 24(2), in press, (2017)
18.Recent Advances in Thermoelectric Power Generation Technology, Journal of the Microelectronics Packaging and Society, 24(2), (2017)
19.Application of Surface Protective Coating to Enhance Environment-Withstanding Property of the MEMS 2D Wind Direction and Wind Speed Sensor, Sensors, 17, 2017
20.Real time resistance monitoring during sintering of silver paste, Journal of Alloys and Compounds 731 (2018) 504-514
21.AISI 304 Steel brazing Using A Flexible Brazing Foil Fabricated by Tape Casting Method, A. Sharma, S. Lee1, J. Oh, J. P. Jung, Korean J. Met. Mater., Vol. 55, No. 12 (2017)
2015 Journal Publications
1.Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation, 1. Materials Transactions, Vol 56, Issue 12, p.2034-2041, 2015
2.Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure, Electronic Materials Letters, Vol 11, Issue 6, p.1078-1084, 2015
3.Electromigration of Composite Sn-Ag-Cu Solder Bumps, Electronic Materials Letters, Vol 11, No. 6, p.1072-1077, 2015
4.Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging, METALLURGICAL AND MATERIALS TRANSACTIONS A, Vol 46, Issue 5, p.2051-2062, 2015
5.Effect of current density on morphology of electroplated tin, Surface Engineering, Vol 31, Issue 6, p.458-494, 2015
6.Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders, Materials and Manufacturing Process, Vol 30, Issue 1, p.127-132, 2015
7.Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping, J. of Materials Engineering and Performance, Vol 24, Issue 3, p.1107-1115,
2015
8.Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy, Materials and Design, Vol 87, p.370-379, 2015
9.High Shear Speed Characteristics of Sub-100 mm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration, J. of Microelectronics and Electronic Packaging, Vol 12, Issue 3, p.161-169, 2015
10.Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.1 - 5, 2015 (KCI)
11.Review of Ag Paste Bonding for Automotive Power Device Packaging, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.15-23, 2015
12.Cu Electroplating and Low Alpha Solder Bumping on TSV for 3-D Packaging, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.7-14, 2015
13.Lead-free Solder Technology and Reliability for Automotive Electronics, J. Microelectron. Packag. Soc., Vol 22, Issue 3, p.1-7, 2015
14.Influence of Various Additional Elements in Al Based Filler Alloys for Automotive and Brazing Industry, J. of Welding and Joining, Vol. 33, Issue5, p.1-8, 2015
2014 Journal Publications
1. Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps, Microelectronics Reliability, Vol 54, Issue 1, p.265-271, January, 2014
2.Analysis of the Electrical Characteristics and Structure of Cu-Filled TSV with Thermal Shack Test, Electronic Materials Letters, Vol 10, Issue 3, p.649-653, May, 2014
3.Effect of Aluminium Additions on Wettability and Intermatallic Compound(IMC) Growth of Lead Free Sn(2wt.%Ag, 5wt.%Bi) Soldered Joints), Electron. Mater. Lett, Vol 10, No. 5, p.997-1004, September, 2014
4.Effect of current density on morphology of electroplated tin, Surface Engineering, 2014
5.Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes, 21(4), 1-7 (2014).
6.Plasma Electrolytic Oxidation in Surface Modification, Journal of Welding and Joining, 32, 3, p.27-33, June, 2014
7.Bonding mechanism and bonding strength of metal and ceramic joint, Journal of Welding and Joining, Vol.32, No.1, February, 2014
8.TSV Filling Technology using Cu Electrodeposition, Journal of Welding and Joining, Vol.32, No.3, June, 2014
9.SiC based Technology ofr High Power Electronics and Packaging Applications, Journal of the Microelectronics & Packaging Society, Vol. 21, No. 2, p. 1-8, 2014
10.Electrical Characteristic and Thermal Shock Property of TSV for 3-Dimensional Packaging, Journal of the Microelectronics & Packaging Society, Vol. 21, No. 2, p. 23-29, 2014
2013 Journal Publications
1.Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation, S.Kumar, J.P.Jung, Mater. Sci. and Eng. B, 178, p.10-21, 2013
2.Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder, J. of Materials Science - Materials in Electronics, Vol. 24, No. 6, June. 2013, p.1748-1757,
3.High Speed Cu-Ni Filling into TSV for 3-Dimensional Si Chip Stacking, Met. Mater. Int, Vol 19, No.1, pp. 123-128, 2013
4.Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering, IEEE Transactions on compo., pack. and manuf. tech., Vol.3, No.4, 2013, p.566-573
5.High-Speed Shear Test for Low Alpha Sn-1.0%Ag-0.5%Cu (SAC-105) Solder Ball of Sub-100-um Dimension for Wafer Level Packaging, IEEE Transactions on on compo., pack. and manuf. tech., Vol.3, No.3, 2013, p.441-451
6.Reflectivity and Thermal Shock Properties of Sn-3.5Ag Electroless-plated Deposit for LED Lead Frames, Korean Journal of Metalsand Materials, Vol 51, No.2, pp. 89-94, 2013
7.Non-PR Sn3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current, IEEE Transactions on compo., pack. and manuf. tech., Vol. 3, No. 4, April. 2013, p.574-580
8.Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters, Vol. 9, No. 4 (2013), pp. 389-392
9.Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering and surface mount technology, Vol25, No.4, 2013
10.Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um size Solder Bumps, Met. Mater. Int, Vol 19, No.5, 2013
11.SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, S.Kumar, S.Agarwal, J.P.Jung, REVIEWS ON ADVANCED MATERIALS SCIENCE, 2013, 12, p185-202
12.Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, S.H.Kee, W.J.Kim. J.P.Jung, Surface & Coatings Technology, 2013, 11, p778-783
13.SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, REVIEWSON ADVANCED MATERIALS SCIENCE, 34, 2, P185-202, December, 2013
14.Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, Surface & Coatings Technology, 235, P778-783, November, 2013
15.Stencil Printing Behavior of LEAD-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um Size Solder Bumps, METALS AND MATERIALS INTERNATIONAL, 19권, 5호, P 1083-1090, September, 2013
16.Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering & Surface Mount Technology, 25, 4, P 209-217, September, 2013
17.Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters 9, 4, P 389-392, July, 2013
18.Mechanical and electronic of Ag3Sn intermatallic compound in lead free solders using ab initio atomisticcalculation, Mater. Sci. and Eng. B, 178, P 10-21, 2013
2005 Journal Publications
1.Reliability of Sn-8 mass% Zn-3 mass % Bi Lead - free Solder and Zn Behaviour, Sun-Yun Cho, Young-Woo Lee, Kyoo-Seok Kim, Young-Jun Moon, Ji-Won Lee, Hyun-Joo Han, Mi-Jin Kim and Jae-Pil Jung, Materials Transactions, Vol. 46. No. 11 (2005) pp. 2322 to 2328
2.Flip Chip Bump Formation of Sn-1.8 Bi-0.8 Cu-0.6 In Solder by Stencil Printing, Jaesik Lee, Jae-Pil Jung, Chu-Seon Cheon, Yunhong Zhou and Michael Mayer, Material Transactions, Vol. 46, No. 11 (2005) pp. 2359 to 2365
3. Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate, I. Lum, J.P. Jung, and Y. Zhou, Metallurgical and Materials Transactions Volume 36A (2005), No. 5, pp. 1279-1286
4.Aging Characteristics of Sn-1.8Bi-0.7Cu-0.6In bump formed by stencil printing, J.S. Lee, S. Cho, Y. Lee, K .Kim C.S. Cheon, J.P. Jung; Journal of Microelectronics & Packaging Society, Vol. 12, No. 4, p.301-306, 2005
5.The Correlation between Stress Relaxation and Steady-State Creep of Eutectic Sn-Pb, W.H. BANG, K.H. OH, J.P. Jung, J.W. MORRIS, Jr., and FAY. HUA, Journal of Electronics Materials, Vol. 34, No. 10, 2005, pp. 1287-1300
6.Electronics Packaging Society, Experimental Study of Ultrasonic Wedge Bonding with Copper Wire, Y.H. Tian, I. Lum, S. J. Won, S. H. Park, J. P. Jung, M. Mayer, Y. Zhou, 2005 6th International Conference on Electronics Packaging Technology(Shenzhen, China Aug 31 ~ Sep 2, 2005), IEEE & CEPS.
7.Reliability of Sn-8 wt%Zn-3 wt% Bi solder and Zn-phase, S. Cho, Y. Lee, K. Kim, J.P. Jung, Y. Moon, J. Lee, H. Han, M. Kim, Journal of Korea Inst. Of Metal and Material, v.43, 9
8.Low temperature soldering of Capacitor with Bi plated Sn-3.5%Ag, M. Kim, S. Cho,, S. Kim, J.P. Jung, Journal of Korean Welding Society, v.23, 3
9.Lower Temperature Soldering of Sn-3.5%Ag solder by Sn-Bi Coating, M. J. Kim, J. Lee, N. JHOU, J. P. Jung, S. H. Kim, International Conference on Lead-free Soldering, May 24~26, 2005, Toronto, Ontario, Canada
10.3-dimensional packaging and packaging technology, J. Kim, J. P. Jung, S .Kim, J. Park, J. of Kor. Weld. Soc., v.23, 2, PP.129~138
11.Fluxless Plasma Bumping of Lead-free Solders and the Reliability effects of Under Bump Metallization Thickness, Joon Kwon Moon, Y. Zhou and Jae Pil Jung, Soldering and Surface Mount Technology, Vol 17(2005), No 2
2004 Journal Publications
1.Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application. Hong, S. M., Kang, C. S., Jung, J. P, IEEE Transactions on Advanced Packaging, Vol 27, No 1,2004, p90 ~ 96
2.Fluxless plasma Pb-free soldering of Si-wafer Effect of plasma cleaning, Jour. Of Microelectronics and packaging Soc., Vol.11 No.1, (2004), p77~85
3.Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass %Ag Solder alloy, Material Transactions Vol.45 No.3, March 2004, p783~798
4.Fluxless Plasma Soldering of Pb-free Solders, J. K. Moon, J.P. Jung, Y. Zhou, K.I. Kang, J.S. Lee. Proceeding of 85th American Welding Society Annual Meeting, pp.46-47, Apr.6-8, 2004, Chicago, IL, USA
5.Characteristics and Reliability of SnBi Coated Lead-free Solder Ball. J.S. Lee, J. P. Jung, W.H. Bang, K.H. Oh, Y .Zhou. 134th Annual meeting of TMS, Mar. 14-18, 2004, Charlotte, NC, USA
6.Thermal impact characteristics of QFP-lead solder joint, Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
7.Study of lower temperature soldering of Sn-3.5Ag solder, Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
8.Reliability and behavior of Sn-8Zn-3Bi solder Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
9.Evaluation of the solerability and joint properties of a new Sn-Cu-Bi-In solder, J. P. Jung, J. M. Kim, J. S. Lee, J. H. Park, S. Cheon, J. W. Park, J. O. Lee, ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA
10.Analysis of Stress Relaxation Characteristic of Chilled Eutectic Sn-Pb Solder, W. H. Bang, M. W. Moon, K. H. Oh, J. P. Jung, J. W. Morris, ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA
11.Joint strength of Sn-8Zn-3Bi solder with PCB surface treatment, Korea Institute of Metals & Materials, Annual meeting in autumn, (2004), Oct.
12.Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer. Joon Kwon Moon, Kyung in Kang, Jae Pil Jung, Yun Hong Zhou. Material Transactions Vol.45 No. 6. June 2004, p1880-1885
13.Effect of plated layer of PCB on the reliability of Sn-3Ag-0.5Cusolder, proceeding of Spring meeting, Korea welding society, (2004), May
14.Fabrication and Solderability of SnBi coated Sn3.5wt%Ag solder, Journal of Korea Institute Of Metals & Materials, vol.42, No.5
15.Application of TLP bonding method to the high Tm lead-free solder, Materials Science Forum, Vol 475-479 (2005) pp.1869-72
2003 Journal Publications
1.Fluxless Wetting Properties of UBM-Coated Si-Wafer to Sn-3.5wt% Ag Solder. Hong, Jae-Yong Park, Choon-Sik Kang, and Jung, IEEE Transaction on Components and packaging technologies, VOL. 26, No 1, 2003
2.Fabrication of solder bumps using Sn-Cu electro-plating for flip chip, Jour. Of Microelectronics and packaging Soc., Vol.10 No.4, , (2003), p39~46
3.Fluxless plasma soldering with different thickness of UBM-layers on Si-wafer, Jour. of Korea Inst. Of Surface Eng., vol.36, no.5, p373~378
4.Study on the characteristics of electroplated solder, Jour. of Korea Inst. Of Surface Eng., vol.36, no.5, p386~392
5.Fluxless Plasma soldering of Pb-free Solders on Si-wafer. Jae-Pil Jung, Joon-Kwon Moon, Soon-Min Hong, TMS 2003 132nd Annual meeting and exhibition, San Diego, USA, 2003
6.Pb - free solder bumping for flip chip package by electroplating. Hwang, Soon-Min Hong, Jae-pil Jung, Choon-sik Kang. Soldering & Surface Mount Technology, Vol. 15 No.2 2003, p10~16
7.Effect of coated thickness on Al brazing, Jour. of Industrial institute of Univ. of Seoul, vol.11, (2003), p109~112
8.Strength and microstructure of SnBi and Bi-coated Sn-3.5%Ag solder, Korea Institute of Metals & Materials, Annual meeting in autumn, (2003), Oct. (selected as excellent poster paper)
9.Reflow soldering and inspection, Surface mount technology, May. 2003, p43~49
10.Solder defects and defectless soldering, Surface mount technology, April. 2003, p73~80
11.Design of PCB and soldering, Surface mount technology, Mar. 2003, p23~30
12.Introduction of soldering and fluxing, Surface mount technology, Feb. 2003, p42~48
13.Reliability tests of solder joints (I), J. of Korea welding Society, vol.21, no.3,p.273-277
Professor Jung has over 240 refereed journal papers and 350 conference presentations, based on his research work which is mostly concerned with electronics interconnections and joining. Some examples of his journal publications are given below:
2016– date, Journal Publications
1.Effect of ZrO2 nanoparticles on the microstructure of Al-Si-Cu filler for low-temperature Al brazing applications, Metallurgical and Materials Transactions A, Volume47, Number1, p.510-521, 2016
2.Effect of graphene nanoplatelets on wetting, microstructure, and tensile characteristics of Sn-3.0Ag-0.5Cu(SAC) alloy, Metallurgical and Materials Transactions A, Volume47, Number1, p.494-503, 2016
3.Compressive strength evaluation in brazed ZrO2/Ti-6Al-4V joints using finite element analysis, Ashutosh Sharma, Se Ho Kee, Flora Jung, Yongku Heo, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 5, p. 1722-1728, 2016
4.Microstructure and brazeability of SiC nanoparticles reinforced Al-9Si-20Cu produced by induction melting, Ashutosh Sharma, Dong-Uk Lim, Jae-Pil Jung, Materials Science and Technology, Volume 32, Number 8, p. 773-779, 2016
5.Effect of La2O3 nanoparticles on the brazeability, microstructure, and mechanical properties of Al-11Si-20Cu alloy, Ashutosh Sharma, Myung Hwan Roh, Jae Pil Jung, Journal of Materials Engineering and Performance, Volume 25, Number 8, p. 3538-3545, 2016
6.Fabrication and shear strength analysis of Sn3.5Ag/Cu-filled TSV for 3D microelectronic packaging, Ashutosh Sharma, Do Hyun Jung, Myong Hoon Roh, Jae Pil Jung, Electronic Materials Letters, Volume 12, Number 6, p. 856-863, 2016
7.Thermal shock, shear and insulating characteristics of epoxy embedded SAC 305 solder joints, Ashutosh Sharma, Young Joo Jang, Jang Baek Kim, Jae Pil Jung, Journal of Alloys and Compounds, Volume 704, p. 795-803, 2017
8.Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders, Ashutosh Sharma, Santosh Kumar, Do Hyun Jung, Jae Pil Jung”, Journal of Materials Science: Materials in Electronics, 2017
9.Effect of AlN Nanoparticle Additions on Microstructure, Solderability and Mechanical Properties of Sn-Ag-Cu solder, Dohyun Jung, Ashutosh Sharma, Dong-Uk Lim, Heung Rak Sohn, Jae Pil Jung, Metallurgical and Materials Transactions A, (2017)
10.Effect of KOH to Na2SiO3 ratio on microstructure and mechanical properties of plasma electrolytic alumina coatings, Ashutosh Sharma, Yong Joo Jang, Jae Pil Jung, Journal of Materials Engineering and Performance, (2017).
11.Effect of brazing current and speed on the microstructure, weld characteristics and mechanical properties of the arc brazed hot-dip galvanized steel sheets using Cu3Si filler, Ashutosh Sharma, Soon Jae Lee, Do Youl Choi, Jae Pil Jung, Journal of Materials Processing and Technology, (2017).
12.Radiation induced errors and low alpha solder bumping solder process in 3-D packaging technology, Do Hyun Jung, Ashutosh Sharma, Jae Pil Jung, Journal of Materials Science (2017).
13.Recent progress in electroless plating of copper, Ashutosh Sharma, Chu-Seon Cheon, Jae Pil Jung, Journal of the Microelectronics and Packaging Society, Volume 23, Number 4, p. 1-6, 2016
14.Recent Advances in Thermoelectric Power Generation Technology, Ashutosh Sharma, Jun Hyeong Lee, Kyung Heum Kim, Jae Pil Jung, Journal of the Microelectronics Packaging and Society, 24(1), 1-8 (2017)
15.Effect of various factors on the brazed joint properties in Al brazing technology, Ashutosh Sharma, Seung Hyun Lee, Hyung Oh Ban Y.S. Shin, Jae-Pil Jung, Journal of Welding and Joining, Volume 34, Number 2, p. 30-35, 2016
16.Transient liquid phase bonding for power semiconductor, Journal of the Microelectronics Packaging and Society, 24(2), (2017)
17.Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation, Journal of the Microelectronics Packaging and Society, 24(2), in press, (2017)
18.Recent Advances in Thermoelectric Power Generation Technology, Journal of the Microelectronics Packaging and Society, 24(2), (2017)
19.Application of Surface Protective Coating to Enhance Environment-Withstanding Property of the MEMS 2D Wind Direction and Wind Speed Sensor, Sensors, 17, 2017
20.Real time resistance monitoring during sintering of silver paste, Journal of Alloys and Compounds 731 (2018) 504-514
21.AISI 304 Steel brazing Using A Flexible Brazing Foil Fabricated by Tape Casting Method, A. Sharma, S. Lee1, J. Oh, J. P. Jung, Korean J. Met. Mater., Vol. 55, No. 12 (2017)
2015 Journal Publications
1.Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation, 1. Materials Transactions, Vol 56, Issue 12, p.2034-2041, 2015
2.Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure, Electronic Materials Letters, Vol 11, Issue 6, p.1078-1084, 2015
3.Electromigration of Composite Sn-Ag-Cu Solder Bumps, Electronic Materials Letters, Vol 11, No. 6, p.1072-1077, 2015
4.Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging, METALLURGICAL AND MATERIALS TRANSACTIONS A, Vol 46, Issue 5, p.2051-2062, 2015
5.Effect of current density on morphology of electroplated tin, Surface Engineering, Vol 31, Issue 6, p.458-494, 2015
6.Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders, Materials and Manufacturing Process, Vol 30, Issue 1, p.127-132, 2015
7.Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping, J. of Materials Engineering and Performance, Vol 24, Issue 3, p.1107-1115,
2015
8.Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy, Materials and Design, Vol 87, p.370-379, 2015
9.High Shear Speed Characteristics of Sub-100 mm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration, J. of Microelectronics and Electronic Packaging, Vol 12, Issue 3, p.161-169, 2015
10.Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.1 - 5, 2015 (KCI)
11.Review of Ag Paste Bonding for Automotive Power Device Packaging, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.15-23, 2015
12.Cu Electroplating and Low Alpha Solder Bumping on TSV for 3-D Packaging, J. Microelectron. Packag. Soc., Vol 22, Issue 4, p.7-14, 2015
13.Lead-free Solder Technology and Reliability for Automotive Electronics, J. Microelectron. Packag. Soc., Vol 22, Issue 3, p.1-7, 2015
14.Influence of Various Additional Elements in Al Based Filler Alloys for Automotive and Brazing Industry, J. of Welding and Joining, Vol. 33, Issue5, p.1-8, 2015
2014 Journal Publications
1. Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps, Microelectronics Reliability, Vol 54, Issue 1, p.265-271, January, 2014
2.Analysis of the Electrical Characteristics and Structure of Cu-Filled TSV with Thermal Shack Test, Electronic Materials Letters, Vol 10, Issue 3, p.649-653, May, 2014
3.Effect of Aluminium Additions on Wettability and Intermatallic Compound(IMC) Growth of Lead Free Sn(2wt.%Ag, 5wt.%Bi) Soldered Joints), Electron. Mater. Lett, Vol 10, No. 5, p.997-1004, September, 2014
4.Effect of current density on morphology of electroplated tin, Surface Engineering, 2014
5.Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes, 21(4), 1-7 (2014).
6.Plasma Electrolytic Oxidation in Surface Modification, Journal of Welding and Joining, 32, 3, p.27-33, June, 2014
7.Bonding mechanism and bonding strength of metal and ceramic joint, Journal of Welding and Joining, Vol.32, No.1, February, 2014
8.TSV Filling Technology using Cu Electrodeposition, Journal of Welding and Joining, Vol.32, No.3, June, 2014
9.SiC based Technology ofr High Power Electronics and Packaging Applications, Journal of the Microelectronics & Packaging Society, Vol. 21, No. 2, p. 1-8, 2014
10.Electrical Characteristic and Thermal Shock Property of TSV for 3-Dimensional Packaging, Journal of the Microelectronics & Packaging Society, Vol. 21, No. 2, p. 23-29, 2014
2013 Journal Publications
1.Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation, S.Kumar, J.P.Jung, Mater. Sci. and Eng. B, 178, p.10-21, 2013
2.Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder, J. of Materials Science - Materials in Electronics, Vol. 24, No. 6, June. 2013, p.1748-1757,
3.High Speed Cu-Ni Filling into TSV for 3-Dimensional Si Chip Stacking, Met. Mater. Int, Vol 19, No.1, pp. 123-128, 2013
4.Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering, IEEE Transactions on compo., pack. and manuf. tech., Vol.3, No.4, 2013, p.566-573
5.High-Speed Shear Test for Low Alpha Sn-1.0%Ag-0.5%Cu (SAC-105) Solder Ball of Sub-100-um Dimension for Wafer Level Packaging, IEEE Transactions on on compo., pack. and manuf. tech., Vol.3, No.3, 2013, p.441-451
6.Reflectivity and Thermal Shock Properties of Sn-3.5Ag Electroless-plated Deposit for LED Lead Frames, Korean Journal of Metalsand Materials, Vol 51, No.2, pp. 89-94, 2013
7.Non-PR Sn3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current, IEEE Transactions on compo., pack. and manuf. tech., Vol. 3, No. 4, April. 2013, p.574-580
8.Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters, Vol. 9, No. 4 (2013), pp. 389-392
9.Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering and surface mount technology, Vol25, No.4, 2013
10.Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um size Solder Bumps, Met. Mater. Int, Vol 19, No.5, 2013
11.SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, S.Kumar, S.Agarwal, J.P.Jung, REVIEWS ON ADVANCED MATERIALS SCIENCE, 2013, 12, p185-202
12.Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, S.H.Kee, W.J.Kim. J.P.Jung, Surface & Coatings Technology, 2013, 11, p778-783
13.SOFT ERROR ISSUE AND IMPORTANCE OF LOW ALPHA SOLDERS FOR MICROELECTRONICS PACKAGING, REVIEWSON ADVANCED MATERIALS SCIENCE, 34, 2, P185-202, December, 2013
14.Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames, Surface & Coatings Technology, 235, P778-783, November, 2013
15.Stencil Printing Behavior of LEAD-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um Size Solder Bumps, METALS AND MATERIALS INTERNATIONAL, 19권, 5호, P 1083-1090, September, 2013
16.Cu filling of TSV using various current forms for three-dimensional packaging application, Soldering & Surface Mount Technology, 25, 4, P 209-217, September, 2013
17.Electrical Characteristics and Thermal Shock Properties of Cu-Filled TSV Prepared by Laser Drilling, Electronic Materials Letters 9, 4, P 389-392, July, 2013
18.Mechanical and electronic of Ag3Sn intermatallic compound in lead free solders using ab initio atomisticcalculation, Mater. Sci. and Eng. B, 178, P 10-21, 2013
2005 Journal Publications
1.Reliability of Sn-8 mass% Zn-3 mass % Bi Lead - free Solder and Zn Behaviour, Sun-Yun Cho, Young-Woo Lee, Kyoo-Seok Kim, Young-Jun Moon, Ji-Won Lee, Hyun-Joo Han, Mi-Jin Kim and Jae-Pil Jung, Materials Transactions, Vol. 46. No. 11 (2005) pp. 2322 to 2328
2.Flip Chip Bump Formation of Sn-1.8 Bi-0.8 Cu-0.6 In Solder by Stencil Printing, Jaesik Lee, Jae-Pil Jung, Chu-Seon Cheon, Yunhong Zhou and Michael Mayer, Material Transactions, Vol. 46, No. 11 (2005) pp. 2359 to 2365
3. Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate, I. Lum, J.P. Jung, and Y. Zhou, Metallurgical and Materials Transactions Volume 36A (2005), No. 5, pp. 1279-1286
4.Aging Characteristics of Sn-1.8Bi-0.7Cu-0.6In bump formed by stencil printing, J.S. Lee, S. Cho, Y. Lee, K .Kim C.S. Cheon, J.P. Jung; Journal of Microelectronics & Packaging Society, Vol. 12, No. 4, p.301-306, 2005
5.The Correlation between Stress Relaxation and Steady-State Creep of Eutectic Sn-Pb, W.H. BANG, K.H. OH, J.P. Jung, J.W. MORRIS, Jr., and FAY. HUA, Journal of Electronics Materials, Vol. 34, No. 10, 2005, pp. 1287-1300
6.Electronics Packaging Society, Experimental Study of Ultrasonic Wedge Bonding with Copper Wire, Y.H. Tian, I. Lum, S. J. Won, S. H. Park, J. P. Jung, M. Mayer, Y. Zhou, 2005 6th International Conference on Electronics Packaging Technology(Shenzhen, China Aug 31 ~ Sep 2, 2005), IEEE & CEPS.
7.Reliability of Sn-8 wt%Zn-3 wt% Bi solder and Zn-phase, S. Cho, Y. Lee, K. Kim, J.P. Jung, Y. Moon, J. Lee, H. Han, M. Kim, Journal of Korea Inst. Of Metal and Material, v.43, 9
8.Low temperature soldering of Capacitor with Bi plated Sn-3.5%Ag, M. Kim, S. Cho,, S. Kim, J.P. Jung, Journal of Korean Welding Society, v.23, 3
9.Lower Temperature Soldering of Sn-3.5%Ag solder by Sn-Bi Coating, M. J. Kim, J. Lee, N. JHOU, J. P. Jung, S. H. Kim, International Conference on Lead-free Soldering, May 24~26, 2005, Toronto, Ontario, Canada
10.3-dimensional packaging and packaging technology, J. Kim, J. P. Jung, S .Kim, J. Park, J. of Kor. Weld. Soc., v.23, 2, PP.129~138
11.Fluxless Plasma Bumping of Lead-free Solders and the Reliability effects of Under Bump Metallization Thickness, Joon Kwon Moon, Y. Zhou and Jae Pil Jung, Soldering and Surface Mount Technology, Vol 17(2005), No 2
2004 Journal Publications
1.Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application. Hong, S. M., Kang, C. S., Jung, J. P, IEEE Transactions on Advanced Packaging, Vol 27, No 1,2004, p90 ~ 96
2.Fluxless plasma Pb-free soldering of Si-wafer Effect of plasma cleaning, Jour. Of Microelectronics and packaging Soc., Vol.11 No.1, (2004), p77~85
3.Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass %Ag Solder alloy, Material Transactions Vol.45 No.3, March 2004, p783~798
4.Fluxless Plasma Soldering of Pb-free Solders, J. K. Moon, J.P. Jung, Y. Zhou, K.I. Kang, J.S. Lee. Proceeding of 85th American Welding Society Annual Meeting, pp.46-47, Apr.6-8, 2004, Chicago, IL, USA
5.Characteristics and Reliability of SnBi Coated Lead-free Solder Ball. J.S. Lee, J. P. Jung, W.H. Bang, K.H. Oh, Y .Zhou. 134th Annual meeting of TMS, Mar. 14-18, 2004, Charlotte, NC, USA
6.Thermal impact characteristics of QFP-lead solder joint, Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
7.Study of lower temperature soldering of Sn-3.5Ag solder, Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
8.Reliability and behavior of Sn-8Zn-3Bi solder Symposium Proceedings of Micro- electronics and packaging Soc., (2004), Nov.
9.Evaluation of the solerability and joint properties of a new Sn-Cu-Bi-In solder, J. P. Jung, J. M. Kim, J. S. Lee, J. H. Park, S. Cheon, J. W. Park, J. O. Lee, ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA
10.Analysis of Stress Relaxation Characteristic of Chilled Eutectic Sn-Pb Solder, W. H. Bang, M. W. Moon, K. H. Oh, J. P. Jung, J. W. Morris, ASM Materials Solutions Conference, Oct 18~21, 2004, Columbus, OH, USA
11.Joint strength of Sn-8Zn-3Bi solder with PCB surface treatment, Korea Institute of Metals & Materials, Annual meeting in autumn, (2004), Oct.
12.Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer. Joon Kwon Moon, Kyung in Kang, Jae Pil Jung, Yun Hong Zhou. Material Transactions Vol.45 No. 6. June 2004, p1880-1885
13.Effect of plated layer of PCB on the reliability of Sn-3Ag-0.5Cusolder, proceeding of Spring meeting, Korea welding society, (2004), May
14.Fabrication and Solderability of SnBi coated Sn3.5wt%Ag solder, Journal of Korea Institute Of Metals & Materials, vol.42, No.5
15.Application of TLP bonding method to the high Tm lead-free solder, Materials Science Forum, Vol 475-479 (2005) pp.1869-72
2003 Journal Publications
1.Fluxless Wetting Properties of UBM-Coated Si-Wafer to Sn-3.5wt% Ag Solder. Hong, Jae-Yong Park, Choon-Sik Kang, and Jung, IEEE Transaction on Components and packaging technologies, VOL. 26, No 1, 2003
2.Fabrication of solder bumps using Sn-Cu electro-plating for flip chip, Jour. Of Microelectronics and packaging Soc., Vol.10 No.4, , (2003), p39~46
3.Fluxless plasma soldering with different thickness of UBM-layers on Si-wafer, Jour. of Korea Inst. Of Surface Eng., vol.36, no.5, p373~378
4.Study on the characteristics of electroplated solder, Jour. of Korea Inst. Of Surface Eng., vol.36, no.5, p386~392
5.Fluxless Plasma soldering of Pb-free Solders on Si-wafer. Jae-Pil Jung, Joon-Kwon Moon, Soon-Min Hong, TMS 2003 132nd Annual meeting and exhibition, San Diego, USA, 2003
6.Pb - free solder bumping for flip chip package by electroplating. Hwang, Soon-Min Hong, Jae-pil Jung, Choon-sik Kang. Soldering & Surface Mount Technology, Vol. 15 No.2 2003, p10~16
7.Effect of coated thickness on Al brazing, Jour. of Industrial institute of Univ. of Seoul, vol.11, (2003), p109~112
8.Strength and microstructure of SnBi and Bi-coated Sn-3.5%Ag solder, Korea Institute of Metals & Materials, Annual meeting in autumn, (2003), Oct. (selected as excellent poster paper)
9.Reflow soldering and inspection, Surface mount technology, May. 2003, p43~49
10.Solder defects and defectless soldering, Surface mount technology, April. 2003, p73~80
11.Design of PCB and soldering, Surface mount technology, Mar. 2003, p23~30
12.Introduction of soldering and fluxing, Surface mount technology, Feb. 2003, p42~48
13.Reliability tests of solder joints (I), J. of Korea welding Society, vol.21, no.3,p.273-277
Awards, Fellowship and Honors
Academic Award (Lifetime Achievement), Korean Welding and Joining Society, 2015
Highly Commended Paper Award, Emerald Literati Network, UK, 2014 & 2006
Best Paper Award, Korean Microelectronic and Packaging Society, 2011
Best Paper Award, Korean Journal of Metals & Materials, 2012
Academic Courses Taught
For undergraduate students; Electronics packaging, Metallic materials, Mechanical metallurgy, Introduction to Materials Engineering
For graduate students; Electronics & semiconductor packaging, Electroplating engineering, Metal processing, Microjoining reliability, Joining & Welding
Academic Award (Lifetime Achievement), Korean Welding and Joining Society, 2015
Highly Commended Paper Award, Emerald Literati Network, UK, 2014 & 2006
Best Paper Award, Korean Microelectronic and Packaging Society, 2011
Best Paper Award, Korean Journal of Metals & Materials, 2012
Academic Courses Taught
For undergraduate students; Electronics packaging, Metallic materials, Mechanical metallurgy, Introduction to Materials Engineering
For graduate students; Electronics & semiconductor packaging, Electroplating engineering, Metal processing, Microjoining reliability, Joining & Welding
