서울시립대학교 UNIVERSITY OF SEOUL
QR code
닫기

박아영

  • 연구분야첨단 반도체 패키징 공정, 해석, 장비, 소재 및 신뢰성
  • 교수연구실과학기술관 521호
  • 전화번호02-6490-2408
  • HOMEPAGE https://avp.uos.ac.kr/
  • EMAILapark@uos.ac.kr

학력사항

2012.01 - 2017.05 State University of New York at Binghamton, 기계공학과 박사
2009.02 - 2011.01 KAIST 기계공학과 석사
2004.03 - 2009.01 KAIST 수리과학과 학사

경력사항

2025.03 - 현재 서울시립대학교 신소재공학과, 조교수
2019.05 - 2025.02 한국기계연구원 반도체장비연구센터, 선임연구원, 대전
2017.03 - 2019.04 Corning Incorporated, Process Modeling Engineer, Corning, NY, USA
2015.11 - 2017.03 Pro-Unlimited, Process Modeling Engineer, Corning, NY, USA

연구실적

(2025) Overview of Mechanical Testing Techniques for Advanced Semiconductor Packaging Process (Submitted)

(2025) Compliant Ultra-thin Die Attach for Curved Free-Form Electronics in Large Field of View LiDAR Detection (Submitted)

(2024) Analysis of deformation of thin polyimide film by pre-strained silicone elastomer, Materials Today Communications 38: 107728.

(2023) Optimization of process parameters in micro-scale pneumatic aerosol jet printing for high-yield precise electrodes, Scientific Reports 13, no. 1: 21297.

(2023) Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging, Advanced Materials Technologies 8, no. 5: 2201479.

(2021) Elimination of thermo-mechanically driven circumferential crack formation in copper through-glass via substrate, IEEE Transactions on Device and Materials Reliability 21, no. 3: 354-360.

논문 및 저서

.

사회활동

2020 - 현재, 한국정밀공학회 여성위원회
2019 - 현재, 한국마이크로전자 및 패키징학회, 학술이사